Thin Solid Films
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Elsevier BV
- Field
- Engineering
- Recent topics
- Metal and Thin Film Mechanics (8%); Electrodeposition and Electroless Coatings (8%); GaN-based semiconductor devices and materials (8%); Semiconductor materials and devices (8%)
- Open access
- Not verified in DOAJ
- Indexed in MEDLINE
- Not verified
- Article processing fee
- $3,120 USD
- ISSN
- 0040-6090
- Last publication year
- 2026
- Country
- Netherlands
This information comes from OpenAlex, and hasn't been independently verified. The journal's own page is the final authority (see the links above).