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Microelectronics Reliability

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Elsevier BV

Field
Engineering
Recent topics
Electronic Packaging and Soldering Technologies (30%); Silicon Carbide Semiconductor Technologies (22%); Integrated Circuits and Semiconductor Failure Analysis (7%); GaN-based semiconductor devices and materials (7%)
Open access
Not verified in DOAJ
Indexed in MEDLINE
Not verified
Article processing fee
$2,280 USD
ISSN
0026-2714
Last publication year
2026
Country
United Kingdom

This information comes from OpenAlex, and hasn't been independently verified. The journal's own page is the final authority (see the links above).